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Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection

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Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection

Payment Terms : T/T

Mold Type : Injection

Packing Level : Transport package

Supply Ability : 2000PCS/Day

Reusable : Yes

Ic Type : BGA,QFP,QFN,LGA,PGA

Model Number : HN25010

Color : Black

MOQ : 500 pcs

Delivery Time : 10 workdays

Cavity Size : 6.04x3.63x0.67 mm

Tray Shape : Rectangular

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Incoterms : EXW, FOB, CIF, DDU, DDP

Warpage : Warpage MAX 0.2mm

Capacity : 5x7=35 PCS

Packaging Details : CARTON, PALLET

Clean Class : General And Ultrasonic Cleaning

Certification : ROHS, ISO

Quality Assurance : Delivery Guarantee, Reliable Quality

Place of Origin : China

Outline Line Size : 50.8×50.8×3.94 mm

Brand Name : Hiner-pack

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

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Durable High‑Temp Waffle Pack Chip Trays for Semiconductor IC Chips

Block static charges that ruin sensitive semiconductor dies. Tolerate repeated high‑temperature exposure without warping. Hunting for robust carriers for precision chip parts? Stand firm against harsh conditions inside busy production lines.


Lock fine‑pitch IC units inside neat grid cavities. Stop unwanted shifting while chips undergo testing and sorting. Eliminate scratches and impact risks to costly semiconductor components. Bring reliable protection across full processing cycles.


Survive countless cycles of loading and unloading. Keep solid dimensional performance under continuous mass‑production use. Satisfy strict protection requirements from semiconductor assembly operations.

Key Features/ Benefits
  • Endure high‑temperature conditions
  • Avoid chip shift & collision
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25010
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 6.04x3.63x0.67 mm
Matrix QTY 5x7=35 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Support semiconductor assembly, chip testing and component transit. Protect fine‑pitch ICs through reflow, sorting and inspection. Reduce scrap loss triggered by static electricity and mechanical impact.


Fit electronics OEM workshops and component warehouses. Provide safe containment for varied integrated‑circuit units during regular large‑batch handling tasks.

Packaging & Shipping/ Services
Pack goods with firm cartons and inner cushioning materials to avoid transit deformation. Arrange shipment via air or sea upon customer confirmation. Provide full shipping documents after dispatch. Track cargo status and update relevant information timely for overseas clients.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

high-temp waffle pack chip trays

      

semiconductor IC chip trays

      

durable waffle pack trays

      
China Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection factory

Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection Images

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